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摘要:
我国尾矿年产量大，目前尾矿的处理方式主要有矿山回填、有价金属回收等，但难以实现尾矿的完全利用。尾矿中含有的大量石英、长石、碳酸盐矿物、硅酸盐矿物和黏土矿物等成分使其具有稳定性好、比面积大、孔隙结构丰富的特点。固−液相变材料（固−液PCMs）潜热大，但相变过程中转变为液相时易发生泄露。利用尾矿来负载固−液PCMs，既能解决其泄露问题，又能为尾矿的资源化利用提供新的途径，减轻生态环境的负担。针对尾矿资源化利用，综述了尾矿的类型及理化特性，尾矿基相变材料的封装制备、热性能提升以及应用。最后，阐述了当前尾矿制备相变材料存在的不足以及对未来研究的展望，以期为相关研究提供参考，促进尾矿在相变储热领域资源化利用的研究。
Abstract:Mining industry produces a large amount of tailings annually in China. Currently, the treatment of tailings mainly includes mine backfill and valuable metal recovery. Which is difficult to realize the full utilization of tailings. The tailings contain quartz, feldspar, carbonate, silicate, and clay minerals, bestows them with good stability, a large specific area and rich pore structure. Solid−liquid phase change materials (solid−liquid PCMs) exhibit significant latent heat. However, they are prone to leakage during solid–liquid phase transition process. Utilizing tailings as carriers to load solid−liquid PCMs not only addresses the issue of leakage but also provides a valorization method for the resource utilization of tailings and reduces the burden on the ecological environment. Aiming at the resource utilization of tailings, this paper reviewed the types and physicochemical properties of tailings, the encapsulation, and preparation of tailings−based phase change materials, thermal property enhancement, and practical applications. Finally, the shortcomings of the current preparation of phase change materials from tailings and the outlook for future research were described. This information can serve as a useful reference for researchers and help advance the progress of utilizing tailings as a resource for phase change heat storage.
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Key words:
- tailings /
- phase change materials /
- encapsulation preparation /
- latent heat enhancement
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图 3 PEG（聚乙二醇）、PEG/Dt（聚乙二醇、硅藻土）、PEG/DCP（聚乙二醇、硅藻土、碳纳米颗粒）和PEG/DCN（聚乙二醇、硅藻土、单壁碳纳米管）复合材料的导热系数[68]
Figure 3.
表 1 典型尾矿的主要组分及其质量分数
Table 1. Main components of typical tailings and their mass fractions
/% 
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表 2 尾矿基FSPCMs的封装技术
Table 2. Encapsulation technology for tailings−based FSPCMs
技术 封装原理 分层封装 矿物与PCMs纳米层间分子间微观作用力固定PCMs（如氢键力、范德华力等） 管状封装 矿物管状内腔以及微观作用力固定PCMs 多孔封装 多孔矿物丰富的孔隙以及微观作用力固定PCMs 核壳封装 矿物形成的核壳结构包裹固定PCMs 网络封装 由矿物构建的网状结构固定PCMs
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表 3 提高FSPCMs潜热的常用技术及其特征
Table 3. Commonly used techniques to enhance the latent heat of FSPCMs and their characteristics
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表 4 常用高导热材料优缺点
Table 4. Advantages and disadvantages of commonly used high thermal conductivity materials
类别 材料名称 导热系数 /(W·m−1·K−1) 优点 缺点 碳基材料 碳纳米管[57] 3000～6000 密度低；大比表面积；分子间作用力大；结构稳定性好；耐腐蚀性强；易获得 易团聚；分散稳定性较差；制备工艺复杂；相容性较差 石墨[58] 1100 石墨烯[59] 3000～5000 金属材料 铜(Cu)[60] 400 较大的比表面积和体积比；易于控制；导热系数高 密度高；耐腐蚀性低；
热稳定性差银(Ag)[61] 429 铝(Al)[62] 237 金属氧化物 二氧化钛(TiO2)[63] 8.4 生物相容性高；较好的化学稳定性；成本低，制备工艺简单 与其他两种材料相比，有较低的导热系数 氧化铝(Al2O3)[64] 41.1 四氧化三铁(Fe3O4)[65] 9.7 碳化硅(SiC)[66] 120
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